| Show Organizer (s): | Reed Exhibitions U.S.A. (Norwalk, CT) |
|---|---|
| Event Date (s): | Jun 03, 2008 - Jun 06, 2008 |
| Venue: | Location To Be Determined - Kuala Lumpur |
| Address: | Contact Show Management for Exact Location Kuala Lumpur |
| No. of Exhibitors: | 323 |
| No. of Attendees: | 7308 |
| Exhibition Floor Size: (sqm) | 4,000 sqm |
| Offical Website of Show: | http://www.nepcon.com.my/ |
Summary
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General Information
About The Event:The industry event dedicated to Malaysia's electronics industry, providing electronic professionals in Malaysia and its neighbouring countries the opportunity to see state-of-the-art electronic components, assembly, production and test equipment, alongside PCB/SMT microelectronics and semiconductor technology. Products and Services:Equipment, materials, systems and services for the printed circuit board and semiconductor industries for packaging, production, design, test and assemblies. Electronic components, passive and active tools and dies, plastic moulds, wires, cables, connectors, sub-contracting as well as contract manufacturing are also included.
Attendee Information
Electronic engineers (Design Test Packaging), production/plant managers, procurement managers, QC/QA managers and executive management from Malaysia.
Exhibitor Information
Equipment, materials, services for printed circuit boards, semiconductors & microelectronics, packaging, production, design, test & assembly technology.
